Widely used in the high-end market of fine processing for metal and non-metal coating removal, surface marking of cosmetic products, medicine, food packaging, polymer materials, PCB board scribing and marking, plastic buttons, electronic components, communication equipment, semiconductor materials , Silicon wafer microvia and so on.
Applicable Product
Widely used in the high-end market of fine processing for metal and non-metal coating removal, surface marking of cosmetic products, medicine, food packaging, polymer materials, PCB board scribing and marking, plastic buttons, electronic components, communication equipment, semiconductor materials , Silicon wafer microvia and so on.
Equipment Introduction
This device can engrave different types of metallic and non metallic materials. The characteristic of UV laser marking is that the focus pointing is relatively small with less thermal impact on the processing materials Therefore, the precision is relatively higher and the engraving patterns are clearer. With the customized software, the marking parameters can be adjusted according to the marking requirements;
Technical Parameters
Laser Type | UV laser |
wavelength | 355nm |
output power | 3/5/10/20W (optional) |
engraving area | 100*100mm (160*160mm) (optional) |
repeated frequency | 20-200Khz |
engraving speed | ≤10000mm / s |
smallest font | 0.15mm |
cooling method | air cooling/ water cooling |
power consumption | 1.0KW / 1.5KW |
required power supply | AC220V±10% 50/60Hz |